Advanced semiconductor package test emphasized at new BiTS Workshop

September 16, 2011 — The Burn-in & Test Socket Workshop (BiTS Workshop) will change its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs," announced Fred Taber, general chairman of the workshop.

The 2012 BiTS Workshop takes place March 4-7, 2012, in Mesa, AZ.

The event will cover next-generation solutions to burn-in and test while still gathering new work on traditional technologies, Taber continued. The BiTS Workshop is not deviating from its mission to present relevant work on "burn-in and test tooling for today’s IC package technologies," said Taber. It is now expanding to cover "what’s next."

Burn-in and test have changed along with the emergence and market adoption of advanced packaging technologies, including wafer-level packaging (WLP) and fan-out WLP, system in package (SiP), wafer-level test of chip scale packages (CSP), embedded die packages, flip chip packages, package-on-package (PoP), and other 3D packaging.

For more information about the BiTS Workshop, visit www.bitsworkshop.org.

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