KLIC wire bonder debuts for low-pin-count, discrete packaging

March 9, 2012 — Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for semiconductor packaging.

The second-generation ball bonder is part of K&S’ Power Series, with higher productivity (more units per hour bonded and new tool features) than the previous generation in low pin count, discrete and cost/performance packaging applications, the company reports.

New features on the next-gen ball bonder include Interactive Programmable Look Ahead Vision to ease first time set-up; Power Series Xpress Loop to help increase the productivity of short wire applications; optional Dual Mag Optics Kit integration for stacked-die bonding; and 10% more units per hour (UPH) than the prior model. The ConnX Plus is field upgradable to the ConnX Plus LAPS, supporting an 87mm2 bondable area.

The ConnX Plus will debut at the Semicon China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also debuting at K&S’ booth: LUMOS Capillary for LED wire bonding and new AccuPlus Hub Blades for discrete semiconductor dicing.

Kulicke & Soffa (NASDAQ: KLIC) designs and manufactures semiconductor and LED assembly equipment. Internet: www.kns.com.

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