March 16, 2012 — Tokyo Electron Limited (TEL) will acquire semiconductor packaging equipment supplier NEXX Systems Inc. NEXX makes advanced deposition equipment, including electrochemical deposition (ECD) and physical vapor deposition (PVD) tools, for wafer-level packaging (WLP).
TEL is acquiring the company to expand its position in advanced packaging interconnect toools. TEL praised NEXX’s ECD and PVD technologies for high performance, low cost of ownership, development flexibility and extendibility to future applications. Hiroshi Takenaka, president and CEO of TEL, called electrochemical deposition "a key differentiating technology" in wafer-level packaging.
These tools will now be available alongside TEL’s broad range of front-end semiconductor manufacturing equipment for global customers. "NEXX provides TEL with an immediate presence in the high growth, back-end packaging arena, while NEXX gains access to front-end growth markets and an unparalleled repository of cutting-edge intellectual property," summarized Tom Walsh, president and CEO of NEXX.
NEXX has 139 employees and is based in Massachusetts, USA. Its 2011 sales totaled $76.5 million. THe company has installed about 140 systems at 40 customers. Learn more about the company at www.nexxsystems.com.