Kyocera doubles flip-chip assembly with new cleanroom in US

February 7, 2012 — Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego. Kyocera America is a Qualified Manufacturer’s List (QML)-certified flip-chip assembly provider.

The cleanroom can fabricate fine-pitch flip-chip multiple components within one operation, and performs vacuum die-attach and vacuum-assembly sealings for flip-chip and multi-chip module (MCM) assembly. The expansion also reduces overall cycle times for all levels of manufacturing at Kyocera America.

Kyocera America can provide prototype to high-volume microelectronics package production in San Diego rather than sending it offshore, said Tim Roth, GM, Kyocera’s Assembly Technology Division. "Along with higher volume production, Kyocera now offers lead-free flipchip assembly, ahead of federal RoHS regulations, which take effect in 2014."

Kyocera provides assembly services for diverse microelectronics markets, including high-speed digital communications, high-reliability applications, high-count I/O devices, high-end servers, multi-core processors and data transport infrastructure. The company recently increased its engineering staff to provide additional customer service, design and development expertise.

Kyocera has performed US microelectronic package manufacturing for more than 40 years; it has performed assembly services in San Diego since 1991.

Kyocera America Inc. provides high-reliability ceramic packages, complex modules, and contract assembly services. It is a wholly-owned subsidiary of Kyocera International, Inc., the North American holding company for Kyocera Corporation. Internet: http://americas.kyocera.com/kai/semiparts

Kyocera Corporation (NYSE:KYO) (TOKYO:6971), the parent and global headquarters of the Kyocera Group, can be found at http://global.kyocera.com/.

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