Synova Laser MicroJet wafer dicing tools to be made by Makino

February 9, 2012 – BUSINESS WIRE — Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.

Laser MicroJet systems virtually eliminate heat in applications such as semiconductor wafer dicing, via drilling, etc. The LMJ

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