February 17, 2012 — The International Electronics Manufacturing Initiative (iNEMI) will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.

Also read: 2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

The day-and-a-half workshop will begin with a review of the product sector key attribute spreadsheets, followed by break-out meetings of the technology groups as they begin the process of identifying technology and infrastructure needs for the electronics manufacturing supply chain. Packaging attendees will be interested in the Packaging & Component Substrates chapter of the roadmap especially.

Membership is not required to participate in the roadmap; non-member participation is encouraged to ensure a broad and accurate perspective of the supply chain.

The iNemi roadmap highlights processes and capabilities that will be needed for future products, including disruptive and emerging technologies. Every 2 years, the Roadmap is mapped out to identify key gaps in technology and infrastructure, R&D needs, and other activities needed for advanced electronics supply chains.

Check out the 2011 Roadmap: MEMS, 3D packaging major factors in iNEMI roadmap

Efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups  (TWGs).  The PEGs, each chaired by a major OEM in the specific sector covered, define the future technology needs of