February 23, 2012 — Wafer-level packaging tool maker NEXX Systems was awarded a $42,765 Workforce Training Fund grant from the state of Massachusetts, where NEXX Systems is headquartered. The grant will help provide training and professional development for more than 100 employees there, improving lean manufacturing techniques and adding to their skill sets.

NEXX will focus trainings on leadership, encouraging employees to enhance their skills, improve individual performance and increase overall productivity. Another major effort will go into continuous process improvement training, with practices based on 6 Sigma, lean manufacturing and the Five S’s. NEXX manufactures its semiconductor packaging equipment in the US, with emphasis on high performance tools for packaging lines and development work.

The Workforce Training Fund works with Massachusetts Governor Deval Patrick and Lieutenant Governor Timothy Murray, training over 85,000 Massachusetts employees since 2007. "With this training, companies create greater efficiencies in doing business, leading to more opportunities for jobs, increases in work capacity and business growth," said Murray.

NEXX Systems provides flip chip and advanced packaging equipment. Learn more at http://www.nexxsystems.com/.

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