March 15, 2011 — KLA-Tencor Corporation (Nasdaq: KLAC), process control and yield management provider for semiconductor and related industries, introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel.

An addition to KLAC’s Component Inspector series, the CI-T620 is a fully automated optical inspector of integrated circuit (IC) packages for 3D measurements and package quality with dual tapers for improved output. Tape and reel is a process of packing surface mount devices by loading them into individual pockets within a pocket tape or carrier tape. The units are sealed in the carrier tape with a cover tape. The carrier tape is wound around a reel for handling and transport. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.

3D metrology inspection down to 5mm and high-resolution imaging capture surface defects down to 40µm. The system boasts faster package changeover (<5 minutes) and a throughput increase of up to 80%, compared to current industry methods. A complete portfolio of unique 2D and 3D inspection capabilities is supported by KLA-Tencor’s proprietary technology, and compatibility with a broad range of packages and sizes: 3 x 3mm to 42.5 x 42.5mm

KLA-Tencor’s component inspector system will be introduced at SEMICON China, taking place March 15-17 at the Shanghai Convention and Exhibition Center.

KLA-Tencor Corporation (NASDAQ: KLAC) provides process control and yield management products for the semiconductor, data storage, LED, photovoltaic, and other related nanoelectronics industries. Additional information may be found at www.kla-tencor.com.

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