Hesse & Knipps heavy wire bonder handles power semis

January 6, 2011 — Wedge and wire bonder maker Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, launched its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.

Hesse & Knipps will demo the wire bond tool at APEC 2012, February 6-9 in Orlando, FL (http://www.apec-conf.org/), Booth 914.

The BONDJET BJ93x heavy wire bonders feature a heavy wire bond head with integrated pull test and 305 x 410mm table travel for automotive electronics and power semiconductor interconnect requirements. The BONDJET BJ920 handles aluminum, gold and copper heavy round wire and ribbon wire at speeds of 3 wires/sec. Patented PiQC Process Integrated Quality Control analyzes 5 critical measurements of bond quality in real time for every bond

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