Teledyne Microelectronics to package Zephyr Photonics VCSELs

January 10, 2012 – Marketwire — Teledyne Microelectronic Technologies, a business unit of Teledyne Technologies Incorporated, will expand its optical packaging portfolio in a partnership with Zephyr Photonics. The companies will package Zephyr Photonics’ proprietary vertical-cavity surface-emitting laser (VCSEL) technology with Teledyne Microelectronics Technologies’ multi-chip module (MCM) and fiber optic assembly technologies.

The companies’ resulting optical interconnect technologies will meet bandwidth and harsh-environment requirements for defense, aerospace, commercial aviation, and oil and gas applications. Zephyr Photonics’ proprietary high-temperature VCSELs can withstand temperatures over 155

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