February 22, 2011 — CEA-Leti, in a multi-partner project with SET, STMicroelectronics, ALES and CNRS-CEMES, will demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.
The chip-to-wafer direct-metallic-bonding technology was developed at Leti to break through certain 3D-integration limitations. For example, the technology allows chips to be attached to a substrate at low temperature and with low bonding pressure. This technology also allows interconnecting the chip and the substrate electrically through local metallic bonding.
Leti has acquired a customized 300mm FC300 pick-and-place tool from SET, Smart Equipment Technology, to demonstrate the technology. The equipment was developed by SET based on its high placement accuracy FC300 system to adapt it to direct-metallic-bonding requirements.
The customized system will be used by the Minalogic PROCEED project. Minalogic is a global competitive cluster specialized in micro- and nanotechnologies and embedded intelligence. In addition to Leti and SET, partners are STMicroelectronics, ALES and the CNRS-CEMES. The PROCEED Minalogic project is a EUR4.2 million, 24-month project that began in December 2009 and is supported by French FIU (Fond Interministeriel Unique).
"SET has a strong interest for this non-thermocompression metal-to-metal bonding, which may be a key to throughput improvement required for the adoption of 3D-IC integration," said Gaël Schmidt, managing director of SET.
CEA is a French research and technology organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. Visit www.leti.fr.
SET, Smart Equipment Technology, is a supplier of high-accuracy die-to-die, die-to-wafer bonding and nanoimprint lithography products. SET is a wholly owned subsidiary of Replisaurus Technologies. Further information is available on www.set-sas.fr.
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