Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 from SUSS MicroTec is a fully-automated, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. These features are said to enable die size and cost reduction for MEMS devices. Additional features include post-bond alignment accuracy for metallic bonds to 1.25µm and cluster design concept and software for 24/7 production. All standard MEMS fabrication processes as well as emerging eutectic, fusion, and metal diffusion bond technologies for integrated devices can be performed.
The CBC200 offers uninterrupted operation while running multiple recipes and multiple process flows. All cluster systems can be reconfigured in the field by adding or replacing modules to keep pace with growing production needs or changes in technology requirements. A high-volume version of SUSS’s CB8, which was introduced to the market in 2007, this tool reportedly completes the company’s wafer bonder series for advanced MEMS. SUSS MicroTec Waterbury, VT. www.suss.com