(August 31, 2008)SANTA CLARA, CA— In celebration of its new 55,000 sq.ft. wafer bumping and back-end processing facility in Penang, Malasia, Pac Tech Packaging Technologies is planning a grand opening ceremony and technical symposium on September 18 and 19, 2008, respectively. The festivities are intended to bring attendees up to date on all facility’s capabilities, and inform them on new developments in packaging technology. Government officials, dignitaries and industry leaders will be in attendance.
According to a company statement, the new facility, located at 11900 Bayan Lepas, Byan Lepas Industrial Zone, Penang, Malaysia, is designed and laid-out to accommodate mass-production, and is reportedly capable of handling up to 600,000 wafers per year. It will provide state-of-the-art wafer bumping and backend processing for semiconductor companies within the Pacific Rim. The building has 40,000 square feet of remodeled production floor space, including cleanroom area. Both are equipped with the latest generation equipment for 300mm wafers.
The new Malaysian facility, Pac Tech Asia, will provide a variety of special applications designed to enhance and support the Asian semiconductor manufacturing community including: electroless Ni/Au under-bump metallization for copper and aluminum devices, solder-paste stencil printing for flip-chips, solder-ball placement for wafer-level CSPs down to 200µm ball diameters, and micro solder-ball placement for fine-pitch applications down to 80µm. More advanced applications include: Ni/Pd/Au metalization for today’s power MOSFET devices and gold wire bonding, tall Ni/Au bumping for RFID applications. The facility offers up to 300mm wafer processing capability.
“This grand opening of our new Asian facility provides us an opportunity to showcase the most cost-effective source of wafer bumping and backend processing in the world,” stated Elke Zakel,Ph.D. President and CEO of Pac Tech GmbH. Thorsten Teutsch, Ph.D. president of Pac Tech USA and VP of Operations for Pac Tech Asia, says that in addition to establishing the company’s global presence, the Malaysian operation will help Pac Tech USA address new customers and increase domestic business as an entry portal to the Asian facility for high-volume customers,
The Advanced Packaging Symposium, which takes place at the Equatorial Hotel in Penang, will feature presentations on microelectronics road-mapping and market trends by E. Jan Vardaman of TechSearch as well as and several other technical presentations on WLCSP, flip chip, and 3D packaging by industry experts from around the world.