If the overflow of registered attendees standing in the hallway, craning their necks to hear what was being said inside the room was any indication, than the primary technology draw at this year’s IMAPS International Device Packaging Symposium was anything to do with 3D packaging technologies; and through silicon via (TSV) processes were clearly stars of the show. Even though the rest of the program featured sessions on the latest in MEMS, biomedical, flip chip, and wafer level and chip scale packaging — all critical and current areas for advanced packaging — the rooms dedicated to those sessions had plenty of seating available.
The AVIA 355-23-250 from Coherent, Inc. delivers over 8 watts of 355-nm output at repetition rates of 250 kHz and higher. The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking, reportedly achieving high-speed IC die singulation with high yields.