The AltaCVD chemical vapor deposition (CVD) and atomic layer deposition (ALD) tool from Altatech combines a unique vaporizer technology, chamber design, and gas/liquid panel integration. The combination of a proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization is said to enable nanoscale control of thickness, uniformity, composition, and stoichiometry in complex materials. These depositions are reportedly unavailable today with existing techniques.

AltaCVD is suited for plasma-enhanced MOCVD and ALD processes of a range of materials used in logic and memory devices, Microsystems, and 3D integration such as high-K gate dielectrics, metal electrodes, high-K coupling dielectrics and electrodes in MIM and DRAM capacitors, ferroelectric materials, chalcogenide alloys for PCRAM, seedless and self-forming copper diffusion barriers, copper seed layers for TSV metallization, transparent conductive oxides, thin film batteries, electrodes and electrolyte. Altatech Grenoble-Monbonnot, France; www.altatech-sc.com