(October 21, 2008) UTICA, NY— Weiping Liu, Ph.D. research metallurgist for Indium Corp. was invited to become a member of the International Scientific Advisory Board for the International Brazing and Soldering Conference (IBSC) 2009, organized by the American Welding Society and ASM International.
The advisory board is an international group of recognized experts in the brazing and soldering community. As a member, Dr. Liu will help review proceeding papers, preliminary conference program information, and website content prior to its release to the general public. He will also be responsible for helping to promote the IBSC.
In his invitation, Dr. Anatol Rabinkin, IBSC 2009 Co-Chairperson, said, “Your scientific and engineering contributions will be an asset to the overall technical success of the program and directly benefit the advancement of the science and technology of brazing and soldering.”
ISBC is scheduled for April 26-29, 2009 in Orlando, Florida. The conference takes place every three years.
Dr. Liu received his Ph.D. in Materials Science and Engineering from the Harbin Institute of Technology, China, and subsequently performed post-doctoral work at the Technical University of Berlin, Germany. He has published 70 research papers in the area of materials joining and processing, and has received several “best paper” awards at various international conferences. Dr. Liu also served on the International Scientific Advisory Board for the AWS and ASM organized International Brazing and Soldering Conferences in 2000 and 2006.