SUSS MicroTec and STS Take the Show on the Road

(October 29, 2008) NEWPORT, UK and GARCHING, Germany&#151 SUSS MicroTec and Surface Technology Systems (STS) are once again hosting a technology roadshow in five major Asian locations from October 29 to November 7. Similar to the US roadshow last spring, the series of one-day events is intended to provide a comprehensive overview of the latest developments 3D Integration and advanced packaging.

Invited speakers from Panasonic, IBM, and Fraunhofer IZM will discuss the optimization of integrated process solutions in respect to performance and cost. Topics cover applications like plasma-dicing, metal-to-metal wafer-level bonding, electrostatic carriers for thin wafer handling, as well as thin chip integration. SUSS MicroTec with STS and their parent company Sumitomo Precision Products Co., Ltd (SPP), will demonstrate total process solutions for 3D wafer level packaging by combining the expertise of STS and SPP in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in photolithography and wafer bonding.

The roadshow will take place at following dates and locations:

  • Tokyo, Japan: October, 29
  • Shanghai, China: October, 31
  • Seoul, South Korea: November, 3
  • Hsinchu, Taiwan: November, 5
  • Singapore: November, 7

    For more information visit www.suss.com/roadshow/

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