Viscom AG has broadened its platform into the semiconductor market with the introduction of the MX20000IR fully automatic wafer inspection system. The application scope of the system includes MEMS, wafer bonds, flip chip and photovoltaics. Wafers can be composed of various materials including silicon, gallium arsenide, aluminum oxide or III-IV composites, and others. The tool can accommodate 150, 200 and 300mm wafers, robot-loaded either from cassette (150 and 200mm) or FOUP(300mm). Wafer identification and pre-alignment are done parallel to inspection, making the system suited to medium and large lot size inspection.

The product series platform is based on Viscom’s patented Si-Thru technology, whose light sources generate illumination in the near-infrared range. Doped silicon is transparent to light within this range, allowing for easy inspection of even subsurface defects. Additional features include scalability, high-performance capability, and high-resolution light sources. Evaluation is based on specialized inspection algorithms which positively locate defects such as voids, seam widths, etc. Statistical process control and integrated process control allow each wafer to be directly identified. Viscom, AG Hanover, Germany; www.viscom.com