TO-250-type hermetic microelectronic packages from CPS Technologies, Inc. were developed for military, electronics, satellite, and aerospace markets, and can be manufactured in a variety of combinations. Products consist of a cold rolled steel frame with hermetic seals made with alloy #52 or copper-cored alloy #52 pins in a compression glass seal or ceramic terminal. Bottom choices can be OFHC copper, copper moly, copper tungsten or glidcop. Braze material is 72% Ag / 28% Cu (BT braze).

CPS’ plating capabilities include electrolytic nickel per QQ-N-290 and ASTM B-689, electroless nickel per Mil-C-26074E and ASTM B-733, and gold per ASTM B-488 and Mil-G-45205C. Tests performed to validate reliabiltiy hermeticity include air to air temperature cycle/shock per MIL-STD-883, method 1010; steam age/solderability testing per MIL-STD-883, method 2003; lead fatigue per MIL-STD-883, method 2004; hermeticity validation to 1 x 10-10 cc/sec of helium per MIL-STD-883, method 1014; Insulation resistance to 10 giga ohms at 500 VDC per MIL-STD-883, method 1003; Salt spray per MIL-STD-883, method 1009; and compliance to JEDEC Std. 9 and Mil-STD-883. CPS Technologies, Inc. Norton, MA www.alsic.com