(June 16, 2008) KUALA LAMPUR, Malaysia &#151 Unisem Berhad and its subsidiary, Unisem-Advantpack Technologies (UAT) have entered into an agreement with FlipChip International (FCI) to license FCI’s wafer bumping and wafer-level packaging (WLP) technologies. The agreement will reportedly include FCI’s core technologies. In return, FCI will become a shareholder in UAT.

With the increased global demand and increased market share for flip chip and WLP, the agreement comes at an ideal time, noted Bob Forcier, FCI president and CEO. “Entering into this licensing agreement with Unisem will not only provide benefits for both of our companies, it will make FCI’s wafer level technologies available to a host of new customers,” he said.

According to S.C. Lau, general manager of UAT, the addition of FCI’s technologies will allow Unisem to offer wafer bumping and WLP alternatives to their customers. He added that FCI is working with Unisem to support a fast ramp-up of the technologies, which in turn will be quickly integrated into their full production environment.