High-speed, Fully Automatic Wedge Bonder for Wire and Ribbon

The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform &#151 including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive &#151 using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.

With axis repeatability of 1&#181m at a balanced encoder resolution of 20 nm, the BONDJET BJ820 provides increased process stability for reportedly reliable bonding of extremely small bond pads with a larger wire diameter. A 12″ x 16.1″ work area can double as two or more smaller stations to accommodate smaller products or substrates. Additionally, its 720 x 1250 mm footprint allows for easy integration into existing floor plan configurations or new concepts. Other capabilities include:

  • 12.5 &#181m to 85 &#181m diameter wire bonding.
  • Ribbon bonding from 6 x 35&#181m to 25 x 250 &#181m.
  • Constant loop height and wire length.
  • Maintains parallel loops within mixed reference system.
  • Auto-teach for linear applications, reducing programming time.

    The BONDJET BJ820 will be showcased at SEMICON West. Booth 7357, West Hall Level 1.
    Hesse & Knipps Paderborn, Germany www.hesse-knipps.com

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