The OptoCooler HV series, a new class of RoHS-compliant high voltage, heat pumping thermoelectric coolers, has been optimized for standard circuitry and power requirements. The OptoCooler HV14, the first module in the series, has been designed for the optoelectronics and telecom industry. OptoCooler HV14 operates at a maximum voltage of 2.9V and can pump 1.7 watts of heat at 85°C in a footprint of 2.8 mm². The module can create a temperature differential of up to 51°C between its hot and cold sides, making it suitable for the cooling and temperature control of optoelectronic devices such as laser diodes and high-brightness LEDs.

At the core of the module is the thermal copper pillar bump, an electronic device made from thin-film thermoelectric material embedded in flip chip interconnects. Thermal bumps act as solid-state heat pumps and add thermal management on the surface of a chip or other electrical component. By reducing the size of the thermal bump by 75%, the company has increased voltages by 300% and reduced the current draw by the same proportion. The net result eliminates the need for special voltage conditioning and reduces the overall electrical current required to operate the device. Nextreme Thermal Solutions, Inc., Research Triangle Park, NC, www.nextreme.com