Samsung embedded memory fits 8 die in 1.4mm stack

September 29, 2011 — Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.

Samsung showcased the package at the 8th annual Samsung Mobile Solutions Forum held at the Westin Taipei. The company also introduced a 32nm dual-core application processor, Exynos 4212; an ultra high-speed LPDDR3 memory; and advanced CMOS image sensors, including a 1/8.2-inch 1.2 Megapixel (Mp) imager and a 1/2.3-inch 16Mp high-sensitivity imager.

The 64GB embedded multimedia card (e-MMC) houses Samsung

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