Air-cooled wafer probe chuck debuts in modular format

October 17, 2011 — ERS uncrated the ERS AirCool 3 wafer thermal test system at last week’s SEMICON Europa in Germany.

ERS designs air-cooled thermal chucks for wafer test because of increased in-field reliability. The Aircool 3 is ERS’s third-generation thermal chuck system that exclusively uses air for cooling.

Features from the AirCool and AirCool plus systems are integrated into a modular system designed to be quickly  upgradeable on site. All major wafer prober systems can be fitted with the AirCool 3.

Modular options include zero footprint applications and semi-remote touch-panel control.

ERS makes thermal chucks for wafer test. Learn more at http://www.ers-gmbh.de/ers-gmbh/index.php.

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