PRNewswire via COMTEX/ — Materials company Brewer Science Inc. and equipment supplier EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.

ZoneBOND works with silicon, glass, and other carriers and existing adhesive platforms. Debonding can take place at room temperature with virtually no vertical force on the device wafer. ZoneBOND defines 2 carrier wafer zones, with strong perimeter adhesion and minimal center adhesion. This allows wafer grinding and backside processing at high temperatures, while enabling low-force separation. The polymeric edge adhesive can be removed by solvent dissolution or other means.

Paul Lindner, executive technology director of EV Group, said, "Combining Brewer Science’s advanced material development and process integration and EVG’s field-proven equipment and process solutions, ZoneBOND will enable customers to achieve a quantum leap in thin wafer processing."

Brewer Science makes specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3D ICs, MEMS, displays, LEDs, and printed electronics. Learn more about Brewer Science at www.brewerscience.com.

EV Group (EVG) makes wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group