November 1, 2011 – Invensas and Allvia have agreed to a patent asset transfer and collaborative development of 3D IC packaging technology, though the description and terms are somewhat nebulous. (We’re awaiting further clarification from both companies.)

Here’s what we know from the official PR statement:

— Invensas is buying 64 patents from Allvia, mostly involving 3D ICs and packaging — namely through-silicon via (TSV) and silicon interposer ("2.5D") technology.
— The two firms have entered into "a two-year collaborative partnership" to further develop technology and IP in 3D IC packaging.

Updated 11/2:  Here’s what we know from a quick email back-and-forth with Invensas and Allvia reps:

— The patent transfer is for everything Allvia owns: silicon interposer for system-on-silicon, TSV, plus micro bumping for wide IO mobile and 3DS DRAM, confirmed Invensas president Simon McElrea. However, Allvia retains a "back license" to offer the IP to other customers. Essentially it’ll continue as a foundry business for any licensees, including Invensas. (McElrea adds that Invensas will hire 3-5 extra 3D engineers.)

— Allvia will continue as an "independent" and "separate" entity. CEO Sergey Savastiouk sees this deal as a way to "allow our interposer and TSV technology to reach the market more broadly and more quickly," adding "support and marketing outreach" to help it get more customers. Moreover, Allvia cleaves off the IP side of its business plan to focus on the manufacturing side. "Someone else will have a task to monetize Allvia IP and to aggressively license and enforce it as well as co-develop future IP," he noted.

"2.5D and 3D are the next technology nodes on DRAM and mobile technology roadmaps," McElrea explained in an email. The Allvia patent purchase & dev agreement will "strengthen our position to license our existing and new customers in our served markets — in short, where they go, we will be."