Fulfilling sustained performance, reliability, and cost targets gained EI the contract modification, said Eric Hills, director of military and defense programs, EI. EI places semiconductor dice, logic, and prepackaged memory along with passive components on its proprietary organic substrate, then attaches a heat spreader and pin connector to form the MCMs. EI purchased a supplemental flip chip packaging line, comprising screen printer, placement systems, a reflow oven, and automated optical inspection (AOI) tools to enable production on the augmented contract.
(August 22, 2007) ATLANTA — Jacket Micro Devices (JMD) patented a fabrication method for 3D, all-organic interconnect structures that uses high- and low-temperature single-sided liquid crystal polymer (LCP) structures. The technique is based on JMD’s multi-layer organic (MLO) packaging portfolio.