(February 8, 2007) MUNICH, Germany — SUSS MicroTec will supply advanced wafer-bonding equipment to the University of Juarez (UACJ), Mexico, for MEMS research and hybrid packaging developments.
(February 8, 2007) MUNICH, Germany — SUSS MicroTec will supply advanced wafer-bonding equipment to the University of Juarez (UACJ), Mexico, for MEMS research and hybrid packaging developments.
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.