(February 27, 2007) STAMFORD, CT &#151 The global semiconductor assembly and test services (SATS) market grew 25.7% in 2006, the fifth consecutive year this sector has exhibited double-digit growth, according to preliminary reports from Gartner, Inc. The SATS industry, the outsourcing portion of back-end packaging, assembly, and test, is propelled by major transitions to advanced packaging, including wafer-level, chip-scale, flip chip, and system-in-package (SiP) methods, said Jim Walker, research VP of Gartner’s semiconductor manufacturing and design research group, and AP Editorial Advisory Board member.