(April 5, 2007) MORRISVILLE, N.C. &#151 Ziptronix, Inc., in conjunction with Raytheon Vision Systems (RVS), demonstrated compatibility with multi-layer CMOS IC production for its Direct Bond Interconnect (DBI) process. The die-to-wafer/wafer-to-wafer bond process uses no external pressure or heat to produce stacked die. Raytheon selected the process to manufacture focal-plane imagers and high-performance sensor arrays, said Stefan Baur, RVS director for advanced technology, and will implement with five-layer CMOS devices with silicon PIN detector devices.