For use in flip chip packaging, EA-6800 and 6900 adhesives are designed for lead-free processing temperatures and fast cure times, respectively. Each adhesive reduces voiding from residual moisture within substrates.
For use in flip chip packaging, EA-6800 and 6900 adhesives are designed for lead-free processing temperatures and fast cure times, respectively. Each adhesive reduces voiding from residual moisture within substrates.
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