(September 5, 2007) SEOUL, South Korea — Hynix Semiconductor reportedly developed a multichip package (MCP) with 24 stacked NAND flash memory chips, improving on its existing design, according to Korea Times.
(September 5, 2007) SEOUL, South Korea — Hynix Semiconductor reportedly developed a multichip package (MCP) with 24 stacked NAND flash memory chips, improving on its existing design, according to Korea Times.
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