(April 11, 2007) BILLERICA, MA &#151 NEXX Systems, a provider of processing equipment for advanced wafer-level packaging applications, has named Didier Andre as Director of European Customer Operations. Andre will work closely with NEXX’s distributor, TELTEC, to strengthen NEXX’s position with existing customers and to establish new opportunities in Europe.
Richard Post, CEO of NEXX Systems, says he is looking forward to working with Andre and welcomes his experience in both semiconductor business and the European marketplace. “His insights, customer knowledge, and energy will serve to grow NEXX’s presence in the European semiconductor arena,” he said.
Andre has more than 20 years of experience in the semiconductor business &#151 13 years with Lam Research Corporation, most recently as their marketing/business development manager in Europe.
“I am looking forward to the challenges of the rapidly evolving wafer-level packaging market,” notes Andre, adding that the company’s product roadmap &#151 with both PVD and electroplating in mass production& #151 provides customers with innovative solutions.
NEXX Systems’ product lines are targeted to the flip chip and advanced packaging markets; and include tools for multi-layer sputter deposition of metals, and high throughput electro-deposition of metals.