MEMS technology spans the entire semiconductor industry, with wafer processes through test, assembly, and packaging. As these micro-sized devices involve delicate structures with mechanical functionalities, specialized materials, equipment, and processes continue to evolve to address the complexities of MEMS manufacturing. Over the past week and a half, SUSS MicroTec and Surface Technology Systems (STS) joined forces to present a U.S.-based roadshow, “MEMS Technology: Embracing the Future,” to share developments that are bringing manufacturing processes into the 300-mm range.
(May 1, 2007) PISCATAWAY, N.J. — The IEEE’s “Nanoelectronics Standards Roadmap (NESR)” suggests five standards for 2007, involving conductive interconnect nanomaterials, organic sensors, and nano-scale devices. With industry approval, the group plans to complete seven nanomaterial and five nanodevice standards for 2008.