IMAPS New England, May 1st in Boxborough, MA, was a regional show with a national feel — a strong technical program, about 70 exhibitors, and approximately 450 attendees checking out technologies and capabilities at booths and listening to detailed keynotes and presentations. The show included a new feature this year — a vendor workshop on the exhibit floor — and a Bond, James Bond theme complete with playing cards, tuxedos, and an energetic environment.
The KADETT semi-automatic device bonder, designed for R&D labs, university research, and pre-production environments, performs high-accuracy placement and bonding processes for advanced packaging, MEMS, and other assembly tasks.