Outsourced Packaging Outgrowing In-house

(August 3, 2007) WELLESLEY, MA &#151 BCC Research finds, in “The Global Market for Advanced Electronic Packaging,” the outsourced semiconductor packaging and test (OSPT) services sector outpacing conventional in-house package-and-test in growth, though outsourcing remains a $16.2B industry compared to $23.3B done in-house. The overall package-and-test market will grow from $38.5B in 2006 to $57.6B by 2011, according to the report.

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