Myers expects 2007 revenues to reach approximately the same level as 2006. Billings rose 3% from Q’01 2007, and increased about 15% over Q’02 2006. Billings fell 4% from the first quarter, and dropped 18% from Q’02 2006. Growth was strong in China and Taiwan, with modest gains in Korea and Japan. Europe, North America, and the rest of world (ROW) regions experienced declines in the semiconductor manufacturing equipment market.
(August 15, 2007) TAIPEI, Taiwan — TSMC board members approved a proposal for capacity investments leading to 300-mm wafer-level packaging (WLP) production capability. The investment equals $59.8 million in capital appropriation. It is designed to reduce form factor for more competitve end products.