Unit-under-test (UUT) packages covered by the system include various standard SOT, SO, MLF, and TO devices, measuring 1.2 × 2 mm through 15 × 21 mm and down to 0.4-mm pitch. The handler is said to increase test speed for larger packages. Modular design provides users with optional additions, such as a loader, unloader, bowl-feed module, etc.
(May 3, 2007) HAUPPAUGE, NY — RVSI Inspection LLC appointed QES, headquartered in Kuala Lumpur, Malaysia, to represent its Lead Scanner and Wafer Scanner product lines in Singapore, Malaysia, Indonesia, and Thailand. QES serves front- and back-end markets.