MURRAY HILL, N.J. – The Garden State Chapter of the International Microelectronics and Packaging Society (IMAPS) held its Spring Packaging Symposium in May where companies provided the latest updates on their new advanced packaging technologies.

The host, Lucent Technologies Bell Laboratories, discussed the process of a gold stud bump bonding process. High-speed GaAs and InP chips usually have gold metallization that is not compatible with standard solder flip chip processes. Gold stud bumping is better suited for these applications, and Lucent has developed a gang coining process that assures uniform stud bump height.

First Level presented a similar attachment technology in which a pin structure (“micro-post”) is formed on standard wire bond pads and directly attached to the corresponding pads on a substrate. The shape of the “micro-post” can be customized for particular applications.

A flexible tool for direct writing of interconnect was discussed by Poto mac Photonics. The system allows maskless patterning of conductors and dielectrics by directly transferring material from a carrier film to the substrate. Additional functionality is possible when the carrier film is removed and the tool can be used for micromachining.

Another deposition approach was presented by Jet Process Corp. Its “jet vapor deposition” technology uses sonic gas jet sources at low pressure to vaporize metals and guide the material to a wafer surface. So far, the process has been most effective for AuSn deposition. This is a potentially economical process because virtually no material is wasted.

– JEFFREY C. DEMMIN