HERNDON, VA. – The National Electronics Manufacturing Initiative (NEMI) launched three new projects as part of its effort to “improve yields and decrease costs of optoelectronic assemblies and products.”

The new projects focus on optic adhesives, fiber handling and fiber optic signal performance. These three projects join two previously announced efforts, optoelectronics solder automation and optoelectronics splicing.

According to Alan Rae, chair of the NEMI Optoelectronics Technology Integration Group and VP of technology at Cookson Electronics, “Companies participating in these projects have the opportunity to shape the future of the industry by sharing in the development of volume manufacturing infrastucture.”