The Wire Bonder 3200’s new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires. The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair. The wire bonder also features optimized ergonomic design and recipe portability from machine to machine, down to 35 µm. The air bearing technology minimizes wear phenomena on the material. Two independent clamps/supports make the processing operation even faster, with a dramatic increase in the units per hour rate. The cooling system has been optimized to ensure constant temperatures even when the bonder is operating at maximum performance. The optional high-resolution visual control system supplies clear, detailed images that improve process monitoring further. Oerlikon Esec, Cham, Switzerland; www.oerlikon.com.