The first award was given to Shari Farrens, PhD, SUSS MicroTec, for her presentation of “Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding.” The second was awarded to Maaike Taklo, PhD, SINTEF ICT, for her presentation of “BCB Bonded Wireless Vibration Sensor.”
(March 10, 2008) Milpitas, CA LSI Corp. today announced that it has signed a definitive agreement to acquire the assets and IP of the hard disk drive semiconductor (HDD) business of Infineon Technologies AG, including product designs, related software, inventory, and test equipment. Financial terms are not being disclosed.