Suited to inspection of MEMS devices, the AW200 Series C-SAM acoustic micro imaging system from Sonoscan performs automated inspection, analysis and sorting of bonded wafers up to 200-mm in diameter. To avoid immersing the bonded wafer pair in water — a technique that can conceal defects — the AW200 images wafer pairs with Sonoscan’s proprietary Waterfall transducer. After imaging, the wafer pair is automatically dried. High-frequency transducers reportedly capable of detecting inter-wafer voids as small as 5-µm in diameter and as thin as 0.02 µm scan the wafer at the same high speed as other C-SAM instruments. Two high-precision robotic arms handle the wafer pairs for increased throughput. Automated analysis of the acoustic data determines bonded/non-bonded areas, the number and sizes of voids, zero-level package seal integrity, and the accept/reject status of the wafer pair according to the user’s criteria. Sonoscan, Elk Grove Village, IL; www.sonoscan.com.