The ultra-high packing fraction (UPF) OptoCooler module addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications. The new module has been optimized for laser diode, LED and advanced sensor products. The UPF OptoCooler removes a maximum of 420 mW of heat at 25°C ambient in an active footprint of only 0.55 mm2. As a result, the module can pump a heat density up to 78 W/cm2. At 85°C, these values increase to 610 mW and 112 W/cm2, respectively. With Nextreme’s thin-film thermal bump technology at its core, the OptoCooler can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications. Nextreme, Durham, NC, www.nextreme.com.
