SEMICON China Expanding

SEMICON China 2008 welcomed more than 1,000 exhibitors and 30,000 visitors. The organization celebrated 20 years of growth for the Chinese semiconductor industry during a gala reception. China has become a major hub for systems-level electronics manufacturing where more companies rely on Chinese labor to compete in an aggressive global market.

ASM Pacific Technology’s latest generation large-area chip bonder, the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic multiple die, SMD, and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool.

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