Rudolph Joins Leading Chipmakers in SEMATECH’s Metrology Program

Under the membership agreement, Rudolph and SEMATECH will jointly establish an International Process Characterization (IPC) program, aimed at the development of process, analysis, and characterization technology to address critical challenges in nanoelectronics research.

(February 21, 2008) — MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its 4th Annual Thermal Management symposium titled “The Heat Is On: Thermal Technology Solutions for Advanced Products.” This one-day technical event will be held on February 28, 2008, at the Wyndham Hotel, San Jose, CA.

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