Antares Advanced Test, IC Test Lab Partner on DUT-level Qual Burn-in

Chipmakers and fabless companies are generally unable to deliver accurate burn-in data to customers when devices that experience varied thermal dissipation and power fluctuations — due largely to shrinking wafer-fab architecture and related current leakage — are qualified in a burn-in chamber with variable ambient temperatures, said Chris Lopez, Antares’ manager of thermal solutions.

(February 22, 2008) St. Florian, Austria — EV Group (EVG) has announced that it has received a multiple system order from Colibrys for one EVG520 semi-automated wafer bonding system and two EVG620 fully automated mask/bond aligners. One bonder and aligner tool set was installed at the Colibrys Inc. manufacturing facility in Stafford, TX, last month, while the other will be installed at the company’s headquarters in Neuchatel, Switzerland before the end of 1Q08.

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