During the workshop, Unovis’ research scientists will review their 2007 findings pertaining to the consortium’s research tracks. More specifically, progress reports will highlight development in the consortium’s lead-free studies, critical in the fundamental understanding of these new interconnect structures. Reliability issues pertaining to surface finishes, underfilling and repair are also topics of discussion. Finally, recent investigations on the TSV stacking process are being presented.
(February 28, 2008) Osaka, Japan — During his keynote today at the Global Electronics Forum in Osaka, Japan, Brian Halla, chairman and CEO of National Semiconductor Corp., discussed a number of key megatrends that will drive chip industry growth. The megatrends include personal mobile devices with enhanced video displays and on-board video projectors; portable medical equipment; and enhanced security and surveillance devices, including smart sensors for low-power, high-precision detectors.