This company’s latest M1 AOI system, the M1m, has been developed with special design enhancements to address the advanced inspection challenges presented by complex wire bonding, epoxy splash, and ever-shrinking component sizes. The system offers advanced high-speed device inspection with good defect coverage. With 3 megapixel resolution, telecentric optics, and proprietary Fusion Lighting technology, the M1m inspects bond wires, die placement, and SMT components and substrates, all within a footprint that is <1 sq. m. The system can be put in-line with wire bonders or off-line to support several bonders. With CAD data input, a complete recipe can be completed in <1 hour. The M1m utilizes a standard SMT package library to simplify training and insure program portability across manufacturing lines. This company's off-line programming software allows the engineer to program the system at any remote location while the system continues with production. YESTech, San Clemente, CA; www.yestechinc.com.