A new, expanded range of SN100C soldering materials are now available, including no-clean ePaste for general reflow purposes, ePaste, a special low voiding paste for critical applications such as die attach in which heat transfer though the joint must be maximized; and a high-performance solder paste with a general purpose “P500” flux medium. Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 245°C. The P500 no-clean halide-free medium delivers good printability, long stencil life, good tack, good reflow, and wetting on all substrates with no solder balls and minimal clear residue. A solution for the lead-free HASL process, SN100CL has good fluidity; good drainage ensures no bridges even on fine-pitch circuitry, good penetration of small diameter holes, uniform coating thickness, and a smooth, bright finish. SN100CL wets quickly and offers low copper erosion. SN100CL forms a stable intermetallic compound layer (Cu/Ni/Sn layer) in between solder and copper laminate. Nihon Superior Co. Ltd., Osaka, Japan; www.nihonsuperior.co.jp.
Booth 249